کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
539557 1450360 2014 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Fabrication of three-dimensional PDMS microstructures by selective bonding and cohesive mechanical failure
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Fabrication of three-dimensional PDMS microstructures by selective bonding and cohesive mechanical failure
چکیده انگلیسی


• Three-dimensional PDMS microstructures were patterned on a Si substrate.
• Adhesion between PDMS and Si was promoted by (3-mercaptopropyl)trimethoxysilane.
• PDMS was selectively bonded to Si where Au patterns are not covered.
• PDMS was remained on Si substrate by cohesive mechanical failure when peeled off.

This paper presents a novel patterning method of polydimethylsiloxane (PDMS) microstructures on solid surfaces by selective bonding and cohesive mechanical failure of PDMS. Generally, when the gold film is laid between PDMS and a Si substrate, Au film with PDMS structure is easily peeled off from a Si substrate because of weak adhesion between Au and the Si substrate. However, when the Au is patterned on the Si substrate locally, PDMS bonds selectively to the Si substrate where Au patterns are not covered. The selectivity of bonding is promoted by treatment with (3-mercaptopropyl)trimethoxysilane on Au patterns and Si substrates. Then, three-dimensional PDMS microstructures are fabricated by a cohesive mechanical failure of PDMS during a dry peel-off process due to enhanced adhesion of PDMS and the Si substrate.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 121, 1 June 2014, Pages 92–95
نویسندگان
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