کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
539650 871266 2011 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging
چکیده انگلیسی

The creep-rupture lives of Sn3.8Ag0.7Cu and Sn3.8Ag0.7Cu0.03Ce lead-free solder joints for electronic packaging were investigated, respectively. And the relationship between creep behavior and intermetallic compound (IMC: Ag3Sn, Cu6Sn5, CeSn3) particles in SnAgCu/SnAgCuCe solder joints has been obtained. Meanwhile, rare earth Ce concentration gradient and retardation effect of Ce on the IMC layer have been observed at the solder/Cu interface. Moreover, aging reaction of Sn and Cu, and the effect mechanism of rare earth Ce on two IMCs (Cu6Sn5 and Cu3Sn) are reported.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 88, Issue 9, September 2011, Pages 2848–2851
نویسندگان
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