Fabrication and characterization of injection molded multi level nano and microfluidic systems

We here present a method for fabrication of multi-level all-polymer chips by means of silicon dry etching, electroplating and injection molding. This method was used for successful fabrication of microfluidic chips for applications in the fields of electrochemistry, cell trapping and DNA elongation. These chips incorporate channel depths in the range between 100 nm and 100 μm and depth to width aspect ratios between 1/200 and 2. Optimization of the sealing process of all-polymer COC microfluidic chips by means of thermal bonding is also presented. The latter includes comparing the bonding strength of UV-treated foils and presentation of a simple model for estimating the delamination pressure. With UV surface treatments, foils of 100 μm thickness were found to withstand pressures up to 9 atm in Ø4 mm cylindrical inlets when thermally bonded to micropatterned substrates of 2 mm thickness.

Figure optionsDownload as PowerPoint slideHighlights
► Fabrication of multilevel Ni shims from Silicon etched masters.
► Injection molding and thermal bonding of all-polymer chips in large numbers.
► Measurement of the bonding strength of samples by means of the razor blade test.
► Study of the bonding strength as a function of bonding parameters.
► Formula for the maximum pressure in channels as a function of crack length.