کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
540090 | 1450398 | 2007 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Fast heating and cooling in nanoimprint using a spring-loaded adapter in a preheated press
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Fast heating and cooling in nanoimprint using a spring-loaded adapter in a preheated press Fast heating and cooling in nanoimprint using a spring-loaded adapter in a preheated press](/preview/png/540090.png)
چکیده انگلیسی
By using a spring-loaded adapter, instant heating and cooling of wafer-type substrates was implemented in standard hot embossing equipment. This was possible by using the well-known concept of a clamped stack of stamp and substrate, pre-assembled in an alignment fixture. A number of thermoplastic and thermocurable resists were molded in an isothermal process with total press occupancy of one cycle of less than 5 min. By further reducing overhead time for mounting and press closing, sub-minute imprint cycles seem possible.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 84, Issues 5–8, May–August 2007, Pages 932–936
Journal: Microelectronic Engineering - Volume 84, Issues 5–8, May–August 2007, Pages 932–936
نویسندگان
Helmut Schift, Sandro Bellini, Jens Gobrecht, Frank Reuther, Mike Kubenz, Morten Bo Mikkelsen, Konrad Vogelsang,