Optimization of demolding temperature for throughput improvement of nanoimprint lithography

Annealing effects onto the reflow of imprinted resist patterns have been investigated on 250 nm dense line arrays printed with standard hot embossing lithography and thermoplastic polymer. Atomic force microscopy measurements were performed to point out the annealing temperature and time effects, respectively. The reflow velocity with respect to annealing temperature has been determined. Its variation is ascribed to both resist dynamic viscosity and surface free energy. Our approach demonstrated that imprint cycle time could be significantly reduced by saving cooling down time.