Examination of board-level drop reliability of package-on-package stacking assemblies of different structural configurations

In this paper, we examine and compare numerically the board-level reliability of fan-in and fan-out package-on-package stacking assemblies subjected to a specific pulse-controlled drop test condition. The transient analysis follows the support excitation scheme and incorporates with an implicit time integration solver. Numerical results indicate that drop reliability of the package-on-package stacking assembly with a fan-out structural configuration is similar to that with a fan-in design.