کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
540923 1450400 2006 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Profile evolution during thermal nanoimprint
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Profile evolution during thermal nanoimprint
چکیده انگلیسی

The evolution of the profile of an imprinted line under squeeze-flow dominated thermal nanoimprint is investigated experimentally. The results indicate, that in the very first moment the stamp intrusion into the polymer is fast due to shear thinning at the periphery of the feature, proceeding along with the build-up of internal stress in the feature centre. Relaxation of this stress proceeds according to the flow time constants. At processing times that are short compared to the time constants, stress relaxation will not be completed. Then the polymer recovers its initial shape in parts, and this recovery is responsible for the final profile shape. As time constants can be tuned by temperature, these investigations are helpful to define adequate low temperature imprint conditions when mixed pattern sizes are imprinted into spin-coated layers.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 83, Issues 4–9, April–September 2006, Pages 843–846
نویسندگان
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