Electrochemical study and electrodeposition of copper in the hydrophobic tri-n-octylmethylammonium chloride ionic liquid media

► The electrodeposition of metallic Copper in binary mixture ionic liquid/organic solvent (tri-n-octylmethylammonium chloride (TOMAC)/chloroform (CHCl3) was investigated. ► The results from the cyclic voltammetry showed that the electrodeposition of metallic Cu in the binary mixture ionic liquid/organic solvent was an irreversible process and was controlled by the diffusion of Cu(II) on a glass working electrode. ► The average value of αnα was found to be 0.23 at 25 °C and the diffusion coefficient (D0) of Cu(II) was calculated to be 7.12 10−9 cm2/s at room temperature.