Nanoimprint with thin and uniform residual layer for various pattern densities

Pattern density variation is uncomfortable for nanoimprint lithography which uses a moldable material supplied as a thin film, because the variation of pattern density causes variations of residual layer thickness reflecting on the local pattern density. To solve the problem, a new type of mold “capacity-equalized mold”, which has constant averaged depth regardless of pattern density, was fabricated and the structure of the mold was inspected. UV nanoimprint was then carried out using the mold and thickness and uniformity of the residual layer were investigated. An average thickness of 33.2 nm with a standard deviation of 3.4 nm was obtained for the mold pattern layout with a pattern density of from 0.25 to 0.75. It was found that a standard deviation of 1.2 nm was achieved for pattern density variation of from 0.33 to 0.67 by excluding artifacts.