The integration of optical interconnections on ceramic substrates

• Manufacturing of the microgrooves in the ceramic substrates
• Integration of optical fibre in ceramic
• Integration of VCSEL and PIN diode in ceramic
• Coupling active elements to optical fibre

High heat conductivity and high heat capacity make ceramic substrates indispensable to the manufacture of Multi-Chip Modules (MCM) and power electronics. In this paper a detailed description of the integration process of optical lines on to ceramic substrates is presented. The manufacturing of microgrooves in ceramic substrates and the process of integration of optical fibres and active elements is described. Coupling active elements to optical fibre is also presented. Through such an integrated optical line a 4 Gbps signal was transmitted.

Figure optionsDownload as PowerPoint slide