Optimization of micro and nanoimprint de-embossing by elastic fracture modelling

A semi-analytical model is presented for the de-embossing phase of the nanoimprint patterning process. The model is based on established principles of elastic fracture mechanics as developed for fibre-bridged cracking in composites. De-embossing is idealized as a steady-state fracture process, which enables the energy change to be considered by reference to a unit cell of a cylindrical polymer post, de-embossing from an axisymmetric stamp. The model provides predictions of the achievable limits for de-embossing as a function of key geometrical variables such as feature size, area ratio and aspect ratio and material properties such as interfacial adhesion, shear strength, polymer yield strength and the ratio of the elastic moduli of the polymer and the stamp. Process ‘maps’ have been created showing de-embossing limits. A strong dependence of the achievable aspect ratio on the pattern area ratio and the interfacial shear stress is seen. For polymer yield stresses similar to that of PMMA, the critical interfacial strain energy release rate has little effect on de-embossing. Large area and aspect ratios are predicted to be achievable by keeping the ratio of polymer and stamp Young’s moduli between 0.015 and 2.5. The model provides key insights into the physical origins of previously observed limits on the achievable aspect ratios and area ratios achieved by imprint patterning.

Figure optionsDownload as PowerPoint slideHighlights
► A semi-analytical model is presented for the de-embossing of nanoimprint.
► Process maps are made of the achievable de-embossing limits.
► There is a strong dependence between AR and f with τ.
► For high polymer yield stresses like PMMA, GiC has little effect on de-embossing.
► Large AR and f are predicted for RE between 0.015 and 2.5.