کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
543031 871618 2011 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal design of hot plate for 300-mm wafer heating in post-exposure bake
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Thermal design of hot plate for 300-mm wafer heating in post-exposure bake
چکیده انگلیسی

Temperature uniformity of a wafer during post-exposure bake (PEB) in lithography is an important factor in controlling critical dimension (CD) uniformity. In this study, a new hot plate system for the PEB of a 300-mm wafer was analyzed and designed. First, temperature deviation on the wafer caused by warpage was investigated, and the heater pattern of the multi-zone hot plate in the bake system was numerically analyzed. Then, a new heater pattern to enhance the temperature uniformity was proposed and tested experimentally. As a result, temperature uniformity within 0.087 °C on a 300-mm wafer was achieved.

A new hot plate system having temperature uniformity of 0.87 °C for the PEB of a 300-mm wafer was developed.Figure optionsDownload as PowerPoint slide

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 88, Issue 11, November 2011, Pages 3195–3198
نویسندگان
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