کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
543031 | 871618 | 2011 | 4 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Thermal design of hot plate for 300-mm wafer heating in post-exposure bake Thermal design of hot plate for 300-mm wafer heating in post-exposure bake](/preview/png/543031.png)
Temperature uniformity of a wafer during post-exposure bake (PEB) in lithography is an important factor in controlling critical dimension (CD) uniformity. In this study, a new hot plate system for the PEB of a 300-mm wafer was analyzed and designed. First, temperature deviation on the wafer caused by warpage was investigated, and the heater pattern of the multi-zone hot plate in the bake system was numerically analyzed. Then, a new heater pattern to enhance the temperature uniformity was proposed and tested experimentally. As a result, temperature uniformity within 0.087 °C on a 300-mm wafer was achieved.
A new hot plate system having temperature uniformity of 0.87 °C for the PEB of a 300-mm wafer was developed.Figure optionsDownload as PowerPoint slide
Journal: Microelectronic Engineering - Volume 88, Issue 11, November 2011, Pages 3195–3198