کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
543625 | 871678 | 2008 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
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چکیده انگلیسی
The nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process was investigated. The nano-scale mold was fabricated; the anti-adhesion property of nanometer-size Si-mold was improved and the surface free energy was calculated with the contact angle measurement. The ∼150 nm width Au nano-wires were successfully fabricated on Si and on flexible polyimide substrate with the proposed process. The PMMA thickness dependent trend with reversal imprinting and Au nano-wires lift-off results were also investigated by SEM analysis.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 85, Issue 7, July 2008, Pages 1561–1567
Journal: Microelectronic Engineering - Volume 85, Issue 7, July 2008, Pages 1561–1567
نویسندگان
Henry J.H. Chen, Li-Chun Chen, Chenhsin Lien, Shou-Ren Chen, Yu-Lun Ho,