کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
543629 871678 2008 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing
چکیده انگلیسی

Thus far, no any effective countermeasure against plating-induced poor uniformity exists in the global packaging market. In this paper, we aim to develop an effective polishing process to improve the poor uniformity existing in advanced double-layer copper pillars. After polishing, the wafer and chip uniformities of copper pillars could be reduced from the original values of 6.8–3.5% and 2.9–0.9%; after reflow, the wafer and chip uniformities of copper pillars reached 3.0% and 1.7%. Excellent uniformity in copper pillars ensures accurate joints, good reliability, high yields, and flexible layouts.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 85, Issue 7, July 2008, Pages 1590–1596
نویسندگان
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