کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
543695 | 1450396 | 2008 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Pressure and resist thickness dependency of resist time evolutions profiles in nanoimprint lithography
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Pressure and resist thickness dependency of resist time evolutions profiles in nanoimprint lithography Pressure and resist thickness dependency of resist time evolutions profiles in nanoimprint lithography](/preview/png/543695.png)
چکیده انگلیسی
Time evolutions of the resist deformation process in thermal nanoimprint have been investigated by numerical simulation and experiments. The simulation and experiments relatively agree with each other in time evolutions of the resist profiles. Dependencies of the process time on both imprint pressure and initial resist thickness are evaluated. In both simulation and experiments, the process time is in inversely proportional to the imprint pressure. On the other hand, the process time increases as the initial thickness decreases. Also, tiny twin peaks are observed in thick resist process.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 85, Issues 5–6, May–June 2008, Pages 842–845
Journal: Microelectronic Engineering - Volume 85, Issues 5–6, May–June 2008, Pages 842–845
نویسندگان
Yoshihiko Hirai, Yuki Onishi, Toshiaki Tanabe, Mayuko Shibata, Takuya Iwasaki, Yasuroh Iriye,