کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
543847 871689 2008 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effects of a magnetic field on the copper metallization using the electroplating process
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Effects of a magnetic field on the copper metallization using the electroplating process
چکیده انگلیسی

We investigated the effects of a magnetic field on the electroplated copper films for the ULSI processes. The magnetic field was induced vertical to the electrodes and varied ranging from 0 to 600 G. The electroplating process was performed with on–off square pulse current source. The variation of the magnetic field vertical to the electrodes affected the deposition rate of the electroplated copper film, step coverage and gap filling in trench. As the intensity of the magnetic field increased, the deposition rate of the copper film increased, and also the resistance of electromigration increased. However, the magnetic field did not affect resistivity and surface morphology of the electroplated Cu film. At higher intensity of the magnetic field, good step coverage was obtained.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 85, Issue 2, February 2008, Pages 308–314
نویسندگان
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