کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
544167 871716 2006 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Chemical mechanical polishing of polymeric materials for MEMS applications
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Chemical mechanical polishing of polymeric materials for MEMS applications
چکیده انگلیسی

Polymeric materials such as polycarbonate (PC) and poly-methyl methacryate (PMMA) are replacing silicon as the major substrate in microfluidic system fabrication due to their outstanding features such as low cost and good chemical resistance. In this study, chemical mechanical polishing (CMP) of PC and PMMA substrates was investigated. Four types of slurry were tested on CMP of the polymers under the same process conditions. The slurry suitable for polishing PC and PMMA was then chosen, and further CMP experiments were carried out under different process conditions. Experimental results showed that increasing table speed or head load increased the material removal rates of the polymers. The polymeric surface quality after CMP was acceptable to most MEMS applications. Analysis of variance was also carried out, and it was found that the interaction of head load and table speed had a significant (95% confidence) effect on surface finish of polished PMMA. On the other hand, table speed had a highly significant (99% confidence) effect on surface finish of polished PC.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Journal - Volume 37, Issue 4, April 2006, Pages 295–301
نویسندگان
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