کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
544275 1450371 2013 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Mechanical properties of nickel fabricated by electroplating with supercritical CO2 emulsion evaluated by micro-compression test using non-tapered micro-sized pillar
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Mechanical properties of nickel fabricated by electroplating with supercritical CO2 emulsion evaluated by micro-compression test using non-tapered micro-sized pillar
چکیده انگلیسی

This paper reports mechanical properties of nickel films fabricated by high pressure electroplating (HPE) and electroplating with supercritical CO2 emulsion (ESCE). Structures and mechanical properties of the plated films were examined by TEM, electron backscattered diffraction analysis and micro-compression test using a non-tapered micro-sized pillar. The films were electroplated in an electrolyte composed of Watts bath, supercritical CO2 and surfactant. Agitation in ESCE leads to the formation of many CO2-in-water type micelles. The micelles would cause an effect called periodic plating characteristic, and this effect refined the microstructure of the plated nickel from 3 μm of columnar grained structure to 8 nm diameter of equiaxial grained structure. Mechanical properties were also improved to 3.5 GPa of compressive strength, which was five times higher than the HPE nickel. The high strength in ESCE is believed to be largely a result of grain refinement and carbon impurity.

Figure optionsDownload as PowerPoint slideHighlights
► Nickel was plated using electroplating technique with supercritical CO2 emulsion.
► Non-tapered micro-sized pillar with square cross section was fabricated.
► Compression tests were conducted with test machine designed for micro-sized specimens.
► TEM shows equiaxial grains with mean grain size of 8 nm in nickel film.
► Maximum stress was reached to 3.5 GPa without any crack up to 9% of strain.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 110, October 2013, Pages 270–273
نویسندگان
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