Atomic layer etching of Al2O3 using BCl3/Ar for the interface passivation layer of III–V MOS devices

• The atomic layer etching of Al2O3 as the interface passivation layer (IPL) has been studied.
• The etch depth could be controlled with the atomic scale precision.
• And the stoichiometry of Al2O3 and the Al/O ratio were maintained the same as the reference.
• It results in minimizing the plasma etching damage at the edge of IPL.

The atomic layer etching (ALET) of Al2O3 has been studied for possible application in precise etch control and low damage etching of the Al2O3 layer for use as the interface passivation layer (IPL) between the high-k dielectric and the III–V compound semiconductors. Under the ALET condition, about 1 Å/cycle of Al2O3 corresponding to one monolayer per etch cycle and surface roughness similar to that of the reference, regardless of the number of etch cycles, were obtained. Therefore, etch depth could be controlled with atomic scale precision. In addition, during the ALET, the stoichiometry of Al2O3 and the Al/O ratio were maintained the same as those of the reference. Therefore, it is believed that the ALET of Al2O3 can reduce the plasma induced damage at the edge of an IPL because it can decrease the sidewall leakage by maintaining the stoichiometry of the sidewall Al2O3 surface, in addition to, precisely controlling the etch depth and minimizing the amount of substrate recess.

Concept of atomic layer etching (ALET) of Al2O3.Figure optionsDownload as PowerPoint slide