Development of an adhesive testing method for two-dimensional fine pattern on silicon substrate using a photoresist column

A novel adhesive strength testing method for a two-dimensional fine pattern on a substrate has been developed. Two types of a silicon (1 0 0) substrate, which were, respectively, pre-treated by O2 plasma and as-received, were prepared to demonstrate the testing method. Circular shape of Pt fine patterns on a Si substrate was utilized as an adhesive test specimen. Three-dimensional KMPR columns were fabricated on Pt circular patterns to assist in applying the bending force to the pattern. All experimental results show that the adhesive strengths of both types of specimens are sufficiently-high, more than 55 MPa, regardless of O2 plasma pre-surface treatment. In the higher aspect ratio region of the KMPR columnar component, more than 0.8, the adhesive strength was almost constant, substantially 55 MPa in both types of specimens. On the other hand, in the lower aspect ratio region, less than 0.7, the adhesive strength was much higher than that in the higher aspect ratio region because of the generated compression stress at the interface. This means that the columnar component with aspect ratio of more than 0.8 is a prerequisite for the adhesive test method. The delamination occurs at the interface between the Pt circular pattern and the KMPR columnar component. All the results show that the adhesive strengths of both types of the specimen are sufficiently-high, more than 55 MPa, regardless of O2 plasma pre-treatment.

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► We develop an adhesive strength test method for a two-dimensional fine pattern.
► We prepare circle pattern with loading column on Si with and without pre-treatment.
► Adhesive strengths in both specimens are constant regardless of the pre-treatment.
► All delamination sites are interface between loading column and fine pattern.
► Adhesive strengths of both type of specimens are sufficiently-high, more than 55 MPa.