Enhanced photo-patterning of polymer dielectrics via imprint lithography

An integrated photolithography and imprint lithography process has been developed to improve the patterning of photosensitive polymers in the fabrication of high aspect-ratio, polymer structures. In the photo-imprint process, a transparent stamp with surface relief structures was brought into contact with a photo-sensitive material. Temperature and pressure were applied to cause the photo-sensitive material to fill the mold, and UV light was then used to irradiate the polymer. The photo-imprint process advance was demonstrated on hollow-core structures. To develop high aspect-ratio, hollow-core pillars, a shallow photo-imprint stamp has been developed to physically displace material from the polymer core. Since the imprint stamp displaces material in the region of the feature, the effective film thickness is reduced compared to the bulk film. The reduction in film height decreased the effect of UV scattering in the core and also facilitated transport of the developer within the core. This photo-imprint lithography process is shown to be able to fabricate hollow core polymer pillars that exceed the optical-only resolution capabilities.

The first demonstration of photo-imprinting of permanent dielectrics has been performed using a surface relief stamp to produce high aspect ratio features.Figure optionsDownload as PowerPoint slideHighlights
► An integrated photolithography and imprint lithography process was demonstrated for permanent dielectrics.
► Improved patterning of photosensitive polymers in the fabrication of high aspect-ratio, polymer structures.
► Photo-imprint stamp with surface relief structures was made and used with photo-sensitive materials.
► High aspect ratio, hollow-core structures were created.