Wireless inter-chip interconnects

Inter-chip wireless interconnect technologies such as inductive coupling and electromagnetic wave propagation have been developed for future high performance system in package at low cost. Inductive coupling is used for near field transmission whose distance is shorter than 100 μm as local wireless interconnects. Antennas are used for far field transmission between chips whose distance is longer than 1 cm as global wireless interconnects. A single-chip Gaussian monocycle pulse (GMP) transmitter using complementary metal oxide semiconductor (CMOS) technology with an on-chip integrated antenna was developed for inter-chip ultra wideband (UWB) communication.