کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
544849 871789 2010 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Micro-deformation of flexible substrate for electronic devices during handling prior to lithography patterning
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Micro-deformation of flexible substrate for electronic devices during handling prior to lithography patterning
چکیده انگلیسی

The dimensional stability of poly(ethylene naphthalene-2,6-dicarboxylate) (PEN) foils during the handling and production process, is crucial for the quality of the final multilayer flexible electronic devices. The foil-on-carrier (FOC) – foil/adhesive/Si-wafer sandwich – is a handling method, which is currently used to temporary attach the foil to a Si-wafer carrier during the lithography processing. This handling method ensures good surface flatness of the foils during the processing. However this technique has two drawbacks: (1) it creates an in-plane micro-deformation of the PEN foil and (2) bending of FOC due to the lamination procedure and lithography processing. In this article the temperature dependence of in-plane foil deformation and bending of FOC was reported and the final curing step of lamination procedure was identified as the main source of in-plane deformation and bending. Finally the resultant stresses introduced to FOC by the curing step derived from the experimental measurements were compared to stress values calculated from the Stoney’s and Ohring’s equations.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 87, Issue 4, April 2010, Pages 641–647
نویسندگان
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