کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5456319 | 1514659 | 2017 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys](/preview/png/5456319.png)
چکیده انگلیسی
In this work, Cu6Sn5 nanoparticles in dimension of 10Â nm are synthesized and first applied to improve the SnBi solder alloys. The microstructure, tensile properties, creep behavior and corrosion resistance of the composite solder are all investigated. Furthermore, solder with 0.05Â wt% Cu6Sn5 nanoparticles presents the best performance among all the samples. Addition of Cu6Sn5 nanoparticles refines the microstructure of SnBi solder. Comparing with the pure sample, tensile properties of the composite one perform a brittle to ductile change. The nanoindentation test reveals that the creep resistance of SnBi-Cu6Sn5 samples is enhanced through the creep mechanism transformation. In corrosion experiments, samples with nanoparticles exhibit a lower corrosion rate. This reinforcement from nanoparticles of intermetallic compounds will provide us a new cognition in solder micro-alloying.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 684, 27 January 2017, Pages 328-334
Journal: Materials Science and Engineering: A - Volume 684, 27 January 2017, Pages 328-334
نویسندگان
Xuezheng Li, Yong Ma, Wei Zhou, Ping Wu,