Charge transfer resistance of copper and nickel thin film electrodes in nano dimensions

Cu and Ni films with thickness ranging from 10 to 200 nm were sputter deposited and their electrochemical impedance was investigated by impedance spectrum to develop the relationship between thickness of thin film electrodes and interface electrochemistry. Both charge transfer resistance and double layer capacitance of the film electrodes decreased with increase in thickness of the thin film electrodes. The current work provided further understanding on interface electrochemistry of thin film electrodes and served as guidance for the design of high performance miniature electrochemical devices.