The effect of AlN nucleation temperature on inverted pyramid defects in GaN layers grown on 200Â mm silicon wafers

We have performed electrical measurements on a wafer with the lowest temperature AlN layer, which is still within our bow specification, and which therefore has the lowest density of inverted pyramid defects. This wafer showed the same leakage current density for both very small and very large test structures (2×10−3 and 18.7 mm2 respectively), with all but one of our large structures maintaining a breakdown voltage greater than 700 V. This is a very promising result for high yield of devices on 200 mm GaN on silicon wafers.