کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5756594 | 1622618 | 2017 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Soldering mask laser removal from printed circuit boards aiming copper recycling
ترجمه فارسی عنوان
حذف لیزر ماسک لیزری از تخته مدار چاپی به منظور بازیافت مس
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
علوم زمین و سیارات
مهندسی ژئوتکنیک و زمین شناسی مهندسی
چکیده انگلیسی
Management of waste of electric and electronic equipment (WEEE) is a key issue for modern societies; furthermore, it contains valuable materials that can be recycled, especially in printed circuit boards (PCB), which have approximately one-third of their weight in copper. In this study we demonstrated the use of laser to strip the covering soldering mask on PCB's, thus exposing the copper underneath so that extraction techniques may take place. Using a Q-Switched Nd:YAG laser operating at 1064Â nm and 532Â nm we tested the procedure under different energy conditions. The laser stripping of the soldering mask was achieved with satisfactory results by irradiation with 225Â mJ at 1064Â nm. However, when using similar parameters at 532Â nm the process of the coating ejection was not promoted properly, leading to a faulty detachment. Infrared laser PCB stripping presents itself to be technically viable and environmental friendly, since it uses no chemicals inputs, offering one more option to WEEE treatment and recycling.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Waste Management - Volume 68, October 2017, Pages 475-481
Journal: Waste Management - Volume 68, October 2017, Pages 475-481
نویسندگان
Marcus Paulo Raele, Lucas Ramos De Pretto, Denise Maria Zezell,