A fast electrodeposition method for fabrication of lanthanum superhydrophobic surface with hierarchical micro-nanostructures

A fast, facile one-step process was developed to fabricate superhydrophobic surfaces by electrodepositing copper substrate in an electrolyte containing lanthanum chloride (LaCl3·6H2O), myristic acid (CH3(CH2)12COOH) and ethanol. Morphology and the chemical structure and composition of the superhydrophobic surface were investigated with SEM, FTIR, XRD, and EDX, respectively. The results indicate that the shortest process for constructing superhydrophobic surface is 1 min, the maximum contact angle is 165° and rolling angle is less than 2°. In the process of electrodeposition time, structure of cathodic copper surface transforms from the blossom buds into nanostructure assemblies, flowers and then into nanorods. In addition, the method can be extended to effectively prepare a superhydrophobic surface with rare-earth element on general conductive material.

A fast one-step process was developed to fabricate superhydrophobic surfaces including lanthanum element, and the needed shortest electrodepositing process is about 1 min. With the electrodeposition time evolution, the structure of cathodic copper surface transforms from the blossom buds into nanostructure assemblies, flowers and then into nanorods. Copper or other conductive material was taken as electrode.Figure optionsDownload as PowerPoint slideHighlights
► Cathodic superhydrophobic surface was prepared by one step electrodeposition method.
► With time evolution, surface morphology grows into buds, flowers and then nanorods.
► The needed shortest deposition time is 1 min with copper electrode.