Preparation and characterization of high-temperature silver thick film and its application in multilayer chip inductances

Conductive silver terminal paste for multilayer chip inductances (MLCIs) was prepared. Surfactant could decrease the apparent viscosity of silver paste and improve the densification of the fired silver films, however, surplus surfactant would worsen the levelability of silver paste because of the decrease in the surface tension of the printed thick films. Suitable dosage of lead-free glass and sintering temperature are also very important to obtain the qualified thick films. Silver thick films containing 5 wt.% frit/silver have high adhesion strength (119 Kgf cm−2), low sheet resistance (5.4 mΩ/□), dense microstructure and excellent electroplating behavior at the fired temperature of 850 °C. MLCIs with as-synthesized silver terminal paste have excellently electrical and mechanical properties.

Silver thick films (MLCI CB3216B700) have high adhesion strength (119 Kgf cm−2), low sheet resistance (5.4 mΩ/□) and dense microstructure under 5 wt.% glass/silver condition at the fired temperature of 850 °C.Figure optionsDownload as PowerPoint slideResearch highlights▶ 1–1.5 wt.% surfactant was ideal for the rheological properties of silver pastes. ▶ 5 wt.% glass gave films dense microstructures and excellent electroplating behaviors. ▶ MLCIs with the silver paste have excellently electrical and mechanical properties.