کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
605957 1454445 2007 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Flavour-encapsulation and flavour-release performances of a commercial yeast-based delivery system
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی شیمی کلوئیدی و سطحی
پیش نمایش صفحه اول مقاله
Flavour-encapsulation and flavour-release performances of a commercial yeast-based delivery system
چکیده انگلیسی

Empty yeast cells are used as a thermo-stable delivery system for flavour encapsulation. The flavour encapsulation efficiency was assessed regarding flavour molecule properties. A model based on passive transfer demonstrated the selectivity of the external cell wall and the attractive role of the internal yeast plasma membrane (phospholipid bi-layer). Not all the molecules can penetrate inside the yeast. Selection is based on the hydrophobic properties. The efficiency of encapsulation is higher than 50% for flavour compound log P higher than 2.0.Flavour release mechanism from yeast cells was characterized using a series of analytical techniques and limonene was used as a model representing a hydrophobic flavour. Dry loaded cells immersed “in water” or “in oil” or “in water and then in oil” showed different behaviours regarding the release performances leading to the careful study of the encapsulation barrier properties. Water is needed for release to occur. The modelling of the drying of the cell wall was consistent with a huge kinetic hysteresis between water sorption and water desorption isotherms. This also explained the unexpected reduction of the cell wall permeability as a function of temperature and water loss. Among others, these conditions insure flavour protection during specific application in cooking processes. Furthermore, organoleptic tests showed higher scores than conventional spray dry powders in battered products and in instant noodles, as expected from the stability conditions investigated.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Food Hydrocolloids - Volume 21, Issues 5–6, July–August 2007, Pages 953–960
نویسندگان
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