کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
6403888 1330898 2014 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Pasting and rheological properties of oat products dry-blended with ground chia seeds
ترجمه فارسی عنوان
چسباندن و خواص رئولوژیکی محصولات جو از خشک با دانه های چیا دانه
کلمات کلیدی
چیا، جو دو سر، امگا 3، رئوئولوژی، چسباندن،
موضوعات مرتبط
علوم زیستی و بیوفناوری علوم کشاورزی و بیولوژیک دانش تغذیه
چکیده انگلیسی


- Oat-chia composites contain omega-3 lipids from chia and β-glucan from oats.
- Oat-chia composites have improved texture and water holding capacities.
- Oat-chia composites are applicable and useful for developing functional foods.

Oat products containing β-glucan are documented for lowering blood cholesterol that could be beneficial for preventing coronary heart disease. Oat products (oat flour, oat bran concentrate, and Nutrim) were dry-blended with ground chia (Salvia hispanica L.) that contains omega-3 polyunsaturated fatty acids for improving nutritional and functional qualities. The pasting and rheological properties of oat-chia composites with 10, 20, and 50 g chia/100 g were characterized using Rapid Visco Analyzer followed by an advanced rheometer. Shear thinning properties were observed for all the composites. The pasting and rheological properties of oat products were not greatly influenced by 10 g or 20 g chia/100 g replacements but were improved at the 50 g/100 g replacement level. Also, these composites had improved water holding capacities compared with their starting oat products from 5 g to 250 g water/100 g, respectively. Also, whole chia seeds currently used in food products on the market are not easily utilized by the human body because of an extremely hard coat. These fine particle composites of oat products with ground chia were prepared by a feasible procedure for producing composites having improved nutritional value, texture quality, and functional food applications.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: LWT - Food Science and Technology - Volume 55, Issue 1, January 2014, Pages 148-156
نویسندگان
, , , ,