کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
644534 1457124 2016 12 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Development of non-Fourier thermal attitude for three-dimensional and graphene-based MOS devices
ترجمه فارسی عنوان
توسعه نگرش حرارتی غیر فوریه برای دستگاه های مجهز به سه بعدی و گرافن
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
چکیده انگلیسی


• Three-dimensional DPL modelling of the 3-D MOSFETs is developed.
• Common 3-D silicon MOSFET, FinFET, and Tri-GATE transistor are dealt.
• The Tri-Gate with the graphene heat spreader is also studied.
• Temperature dependent thermal characteristics of silicon are also considered.
• This 3-D model makes it easy to achieve the real contingencies in 3-D transistors.

In this paper, the intact subject of 3-D MOSFETs is studied. Three well-known 3-D MOSFET nano-devices, including a common three dimensional silicon MOSFET, the FinFET, and the Tri-Gate, are dealt. Firstly, by implying the three dimensional non-linear Dual-Phase-Lag method, the obtained results are verified with the existent data. Contemporaneously, the important parameter B=τt/τqB=τt/τq, which is prerequisite for DPL modeling, is found for the 3-D silicon. The adjusted parameter B, is used to study the 3-D transistors with temperature-dependent thermal characteristics. It is found that taking into account such relevancy, makes the overall trends of distributions unmodified. Finally, the effect of contemplating the graphene sheet heat remover in a 3-D Tri-Gate MOSFET is investigated. Notably, the graphene makes the process of cooling the transistor get accelerated. It is obtained that 40 ps after switching off the heat generation region, the value of the peak temperature of a 3-D Tri-Gate transistor along the center-line with a graphene heat remover, becomes 20% lower than that of a common 3-D Tri-Gate MOSFET. This finding shows that the Fourier calculations, overestimate the results.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Thermal Engineering - Volume 104, 5 July 2016, Pages 616–627
نویسندگان
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