Preparation and thermal performance of paraffin/Nano-SiO2 nanocomposite for passive thermal protection of electronic devices

In this paper, three grades of nano silicon dioxide (nano-SiO2), NS1, NS2 and NS3, were mixed into paraffin to prepare nanocomposites as novel insulation materials for electronic passive thermal protection applications. The optimal mass percentages of paraffin for the three composites, NS1P, NS2P and NS3P, were determined to be 75%, 70% and 65%, respectively. Investigations by means of scanning electron micrographs (SEM), differential scanning calorimeter (DSC), thermogravimetric analysis (TG), hot disk analyzer and thermal protection performance tests were devoted to the morphology, thermal properties and thermal protection performance analysis of composites. Experimental results showed that paraffin uniformly distributed into the pores and on the surface of nano-SiO2. Melting points of composites declined and experimental latent heat became lower than the calculated values with the decrease of nano-SiO2 pore size. The NS1P composite had larger thermal storage capacity, better reliability and stability compared with NS2P and NS3P. In addition, compared with 90% wt.% paraffin/EG composite, the incorporation of NS1 (25 wt.%) into paraffin caused not only 63.2% reduction in thermal conductivity, but also 21.8% increase in thermal protection time affected by the ambient temperature. Thus those good properties confirmed that NS1P (75 wt.%) composite was a viable candidate for protecting electronic devices under high temperature environment.