کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6472748 | 1424136 | 2016 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Four types of via-filling models are developed in this paper, considering distinct chemical behaviour of additives used in the TSV electroplating. The surface convection, surface diffusion and the effect of the curvature are considered in the equation of the coverage of additives, which is solved by a weak form of the PDEs. The simulation results of the different models are compared. Sensitivity analyses of the important parameters in the four models are conducted. Thus, the influences of parameters on the via-filling process are investigated. Conclusions are drawn based on the analysis of the developed numerical models.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 221, 10 December 2016, Pages 70-79
Journal: Electrochimica Acta - Volume 221, 10 December 2016, Pages 70-79
نویسندگان
Yan Wang, Wenhui Zhu, Xiang Li, Fuliang Wang,