Studies on thermal properties and thermal control effectiveness of a new shape-stabilized phase change material with high thermal conductivity

► A new shape-stabilized PCM with higher thermal conductivity is prepared. ► The material overcomes the packaging difficulty of traditional PCMs used in thermal control unit. ► The EG greatly improves thermal conductivity with little effect on latent heat. ► The material has high thermal stability and good heat storage/release performance. ► The effectiveness of the material for electronic device thermal control is proved.