کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
649303 1457203 2009 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Assessment of thermoelectric module with nanofluid heat exchanger
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
Assessment of thermoelectric module with nanofluid heat exchanger
چکیده انگلیسی
Results show that there exist a lag-time in thermal response between the module and the heat exchanger. This is attributed to thermal contact resistance between the two components. A comparison of nanofluid and deionized water data reveals that the temperature difference between the hot- and cold-side, ΔT = Th − Tc ≈ 0, is almost zero for nanofluid whereas ΔT > 0 for water. When ΔT ≈ 0, the contribution of Fourier effect to the overall heating is approximately zero hence enhancing the module cooling capacity. Experimental evidence further shows that temperature gradient across the thermal paste that bonds the chip and heat exchanger is much lower for the nanofluid than for deionized water. Low temperature gradient results in low resistance to the flow of heat across the thermal paste. The average thermal contact resistance, R = ΔT/Q, is 0.18 and 0.12 °C/W, respectively for the deionized water and nanofluid. For the range of optimum current, 1.2 ⩽ current ⩽ 4.1 A, considered in this study, the COP ranges between 1.96 and 0.68.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Thermal Engineering - Volume 29, Issues 2–3, February 2009, Pages 491-500
نویسندگان
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