کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
649341 1457210 2007 11 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Application of phase change materials in thermal management of electronics
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
Application of phase change materials in thermal management of electronics
چکیده انگلیسی

Application of a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions. Also, a two-dimensional numerical study was made and compared the experimental results. Results show that increased power inputs increase the melting rate, while orientation of the package to gravity has negligible effect on the thermal performance of the PCM package. The thermal resistance of the device and the power level applied to the PCM package are of critical importance for design of a passive thermal control system. Comparison with numerical results confirms that PCM-based design is an excellent candidate design for transient electronic cooling applications.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Thermal Engineering - Volume 27, Issues 17–18, December 2007, Pages 2822–2832
نویسندگان
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