Improved mechanical strength and reflectance of diamond wire sawn multi-crystalline silicon wafers by inductively coupled plasma (ICP) etching

Improved mechanical strength and reflectance of diamond wire sawn multi-crystalline silicon wafers by inductively coupled plasma (ICP) etching

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Solar Energy Materials and Solar Cells - Volume 185, October 2018, Pages 511-516

Felix Kaule, Benjamin Köhler, Jens Hirsch, Stephan Schoenfelder, Dominik Lausch,