کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
660524 | 1458113 | 2011 | 16 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A numerical model for transport in flat heat pipes considering wick microstructure effects
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
A transient, three-dimensional model for thermal transport in heat pipes and vapor chambers is developed. The Navier-Stokes equations along with the energy equation are solved numerically for the liquid and vapor flows. A porous medium formulation is used for the wick region. Evaporation and condensation at the liquid-vapor interface are modeled using kinetic theory. The influence of the wick microstructure on evaporation and condensation mass fluxes at the liquid-vapor interface is accounted for by integrating a microstructure-level evaporation model (micromodel) with the device-level model (macromodel). Meniscus curvature at every location along the wick is calculated as a result of this coupling. The model accounts for the change in interfacial area in the wick pore, thin-film evaporation, and Marangoni convection effects during phase change at the liquid-vapor interface. The coupled model is used to predict the performance of a heat pipe with a screen-mesh wick, and the implications of the coupling employed are discussed.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 54, Issues 1â3, 15 January 2011, Pages 153-168
Journal: International Journal of Heat and Mass Transfer - Volume 54, Issues 1â3, 15 January 2011, Pages 153-168
نویسندگان
Ram Ranjan, Jayathi Y. Murthy, Suresh V. Garimella, Unnikrishnan Vadakkan,