کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
661000 | 1458155 | 2007 | 11 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of water and iso-propyl alcohol relative humidities on single wafer cleaning system performance
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effects of water and iso-propyl alcohol relative humidities on single wafer cleaning system performance Effects of water and iso-propyl alcohol relative humidities on single wafer cleaning system performance](/preview/png/661000.png)
چکیده انگلیسی
As the pattern size scales down and the wafer size increases, the particle defects should be controlled more strictly in the modern microelectronics fabrication. Single wafer cleaning processes are introduced in the industry due to higher particle removal efficiency and lower particle reattachment possibility. In this study, the origins of watermark defects in single wafer cleaning system were identified, and the ways to avoid the problems were suggested through a model based numerical simulation. The watermark defects observed in the single wafer cleaning systems were found to originate from the failure of controlling water and iso-propyl alcohol (IPA) relative humidities in the surrounding gas. Increasing the IPA relative humidity in the surrounding gas during the drying phase could improve watermark defects and increase product yields.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 50, Issues 21â22, October 2007, Pages 4275-4285
Journal: International Journal of Heat and Mass Transfer - Volume 50, Issues 21â22, October 2007, Pages 4275-4285
نویسندگان
J. Koo, T. Kim, C. Jung, J. Lee, T. Kim,