Assessment of acoustic-mechanical measurements for crispness of wafer products

The results showed that both instrumental methods are capable to differentiate products of different quality, but in different ways. Only the maximum sound pressure (r = 0.89) and the number of force peaks (r = 0.83) of both tests correlate. The sensory descriptor “crispness” was mainly correlated with the area under sound-displacement curve (r = 0.76) and mean sound value (r = 0.59) of the cutting test, and weakly related to the number of force peaks (r = 0.42), the maximum sound pressure (r = 0.50) and the area under sound-displacement curve (r = 0.42) of the 3-point bending test.