Three-dimensional simulation on heat transfer in the flat evaporator of miniature loop heat pipe

A complete three-dimensional model is developed to investigate the flow and thermal transport in the flat evaporator of a miniature loop heat pipe. The model is involved in flow and heat transfer in the wick and vapor groove, which is conjugated with heat conduction in the wall. The pressure and temperature of boundary conditions are coupled with the operating status of the LHP. Effect of structural parameters of vapor groove in the flat evaporator is investigated in details under the specific heat flux. The results show that heat transfer coefficient of evaporator with vapor groove inside the sintered wick is greater than that inside the solid wall when the wick is in fully saturated operating status. The results predict that the optimum of form factor(α) of vapor groove is 1, and when ratio(β) between interval of vapor grooves and width of vapor groove is the less, wall temperature of evaporator (i) is the lower. The suitable range of β is from 0.5 to 1.

► A complete 3-D model is developed to study the performance of the flat evaporator.
► Pressure and temperature of boundary conditions are coupled with operation of LHP.
► Structural effects of vapor groove are investigated under the specific heat flux.
► The results predict effect of location and structural parameters of vapor groove.