Heat transfer and pressure drop experiments on CMOS compatible microchannel heat sinks for monolithic chip cooling applications

► A novel CMOS compatible microchannel heat sink fabrication technique is developed. ► The monolithic design minimizes the thermal resistance introduced by the heat sink. ► The fabrication process is straightforward and flexible. ► A single channel heater simulating a hot spot was operated up to 127 W/cm2 heat flux. ► Microchannels have 35-80 μm hydraulic diameters, much smaller than traditional ones.