کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6742891 | 1429321 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Influence of intermetallic compounds on the microstructure and strength properties of diffusion bonded W-steel joints using Ti/Ni composite interlayer
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی انرژی
مهندسی انرژی و فناوری های برق
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Influence of intermetallic compounds on the microstructure and strength properties of diffusion bonded W-steel joints using Ti/Ni composite interlayer Influence of intermetallic compounds on the microstructure and strength properties of diffusion bonded W-steel joints using Ti/Ni composite interlayer](/preview/png/6742891.png)
چکیده انگلیسی
Dissimilar W/steel metals were successfully joined by diffusion bonding process with the help of a Ti/Ni composite interlayer. The effect of bonding temperature and holding time on interfacial microstructure and mechanical properties of the bonded joints were investigated. Metallographic and compositional analyses show that no intermetallic compound was observed at the W/Ti and Ni/steel interfaces, but Ti2Ni, TiNi and TiNi3 were formed at the Ti/Ni interface at 850-1050â¯Â°C for 0.5-2â¯h. Tensile test showed that variations in the strength of the joint were strongly related to the intermetallic compounds in the diffusion zone of the Ti/Ni interface. The maximum tensile strength of â¼267â¯MPa was obtained for the joint diffusion bonded at 950â¯Â°C for 1â¯h, and the failure took place at both the W/Ti interface and W substrate. With further increase of the joining temperature, the holding time or both, the joint strength dropped as a function of the increase in the width of Ti-Ni intermetallic compounds, and the failure occurred at intermetallics layers of the Ti/Ni interface.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Fusion Engineering and Design - Volume 132, July 2018, Pages 110-118
Journal: Fusion Engineering and Design - Volume 132, July 2018, Pages 110-118
نویسندگان
Qingshan Cai, Wensheng Liu, Yunzhu Ma, Wentan Zhu, Xinkuan Pang,