Interfacial reactions in Sn–Sb/Ni couples

Sn–Sb alloys are viable candidates of high-temperature Pb-free solders, and Ni is the common surface finish in electronic packaging. Sn–Sb/Ni is an important soldering joint in electronic products. This study examines the Sn–Sb/Ni liquid/solid interfacial reactions at 270, 320, 400 and 500 °C. The experimental results show that Sn–Sb/Ni interfacial reactions are similar to those of Sn/Ni. At 270 and 320 °C, the reaction path is Sn–Sb/Ni3Sn4/Ni. At 400 and 500 °C, the reaction path is Sn–Sb/Ni3Sn4/Ni3Sn2/Ni3Sn/Ni. The growth rate constants of the intermetallic compounds at each reaction temperature are determined. Sb addition in pure Sn slightly decreases the reaction rate. The determined activation energy are 23.0 and 27.6 kJ/mol for Sn–5 wt%Sb/Ni and Sn–10 wt%Sb/Ni couples, respectively.

► Sn–Sb/Ni interfacial reactions are similar to those of Sn/Ni.
► The kinetics of Sn–Sb/Ni liquid/solid interfacial reactions are determined.
► Sb addition in pure Sn decreases slightly the reaction rate.