Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process

Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 163, 1 September 2016, Pages 83-97

Aizat Abas, Haslinda M.S., M.H.H. Ishak, Nurfatin A.S., M.Z. Abdullah, F. Che Ani,