Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction

Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 137, 2 April 2015, Pages 117-123

B. Vianne, S. Escoubas, M.-I. Richard, S. Labat, G. Chahine, T. Schülli, A. Farcy, P. Bar, V. Fiori, O. Thomas,