Electrical characteristics of a novel interposer technique using ultra-low-resistivity silicon-pillars with polymer insulation as TSVs

Electrical characteristics of a novel interposer technique using ultra-low-resistivity silicon-pillars with polymer insulation as TSVs

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 137, 2 April 2015, Pages 146-152

Weijiang Wang, Yangyang Yan, Yingtao Ding, Shiwei Wang, Weimin Wang, Yipeng Sun, Qianwen Chen,