Improvement of thermal stability and electrical property of Cu/Cu(Zr)/SiOC:H film stack by controlling the structure and composition of Zr(Ge) nano-interlayer

Improvement of thermal stability and electrical property of Cu/Cu(Zr)/SiOC:H film stack by controlling the structure and composition of Zr(Ge) nano-interlayer

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 118, 25 April 2014, Pages 41-46

B. Liu, Y.P. Zhang, K.W. Xu,