Highly reliable molecular-pore-stacking (MPS)/Cu interconnects featuring best combination of post-etching treatment and resputtering processes

Highly reliable molecular-pore-stacking (MPS)/Cu interconnects featuring best combination of post-etching treatment and resputtering processes

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 118, 25 April 2014, Pages 72-78

Daisuke Oshida, Ippei Kume, Hirokazu Katsuyama, Makoto Ueki, Manabu Iguchi, Shinji Yokogawa, Naoya Inoue, Noriaki Oda, Michio Sakurai,